Material | FR4 CEM1 CEM3 Hight TG |
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Base Material | FR-4 |
Copper Thickness | 1/2 Oz Min; 12 Oz Max |
Board Thickness | 0.2mm-6mm(8mil-126mil) |
Min. Hole Size | 0.20mm |
Model NO. | Rigid-Flex Board |
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Processing Technology | Electrolytic Foil |
Base Material | Copper |
Insulation Materials | Epoxy Resin |
Surface Treatment | Immersion Silver, Tin, Gold/OSP/Has |
Model NO. | Rigid-Flex Board |
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Surface Finish | HASL, Gold Finger, OSP, Enig, Peelable Mask |
Insulation Materials | Epoxy Resin |
PCB Type | Rigid PCB, Flex PCB, Rigid-Flex PCB |
Service | PCB, PCBA, SMT, Components |
Base Material | FR4 |
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Application | Electronics Device |
Number Of Layers | 1- 40 Layers |
Solder Mask | Green/Red/Yellow/Blue/White/Black ETC |
PCB QC | Electrical Testing,Flying Probe Tester |
Base Material | FR4 CEM1 CEM3 Ceramic Aluminum |
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Min. Line Spacing | 0.1mm/4mil |
Min. Hole Size | 0.1mm-1mm |
Surface Finishing | HASL,Gold Plating |
Product Name | Electronic Boards |
Type | Multilayer PCB |
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Place Of Origin | Guangdong, China |
Base Material | FR4 |
Material | FR4 CEM1 CEM3 Hight TG |
Copper Thickness | 0.5OZ--6 OZ |
Model NO | Double Sided PCB-4 |
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Base Material | Fr-4 |
Insulation Materials | Organic Resin |
Model | FR-4 |
Surface | OSP,Immersion Gold,Hal Lead Free,Hal |
Place Of Origin | Guangdong, China |
---|---|
Type | Multilayer PCB |
Number Of Layers | 1- 24 Layers |
Base Material | FR-4 |
Copper Thickness | 1oz |
Model Number | Multilayer Pcba |
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Type | Consumer Electronics Pcba |
Brand Name | OEM |
Supplier Type | Multilayer Pcba Manufacture |
Copper Thickness | 1 Oz |
Type | Rigid Circuit Board |
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Place Of Origin | Guangdong, China |
Dielectric | FR-4 |
Material | Fiberglass Epoxy |
Application | Consumer Electronics |