Type | Consumer Electronics PCBA |
---|---|
Place Of Origin | Guangdong, China |
Base Material | Copper |
Insulation Materials | Organic Resin |
Brand | Fast PCB Technology |
Name | FPC |
---|---|
Base Material | FR-4 |
Min. Line Width | 0.1mm(Flash Gold)/0.15mm(HASL) |
Surface Finishing | Immersion Gold |
Copper Thickness | 1oz |
Ntegration | GSIC |
---|---|
Technics | Thin Film IC |
Trademark | OEM |
Base Material | FR-4/aluminum/ceramic/cem-3/FR-1 |
Min. Line Spacing | 0.2mm |
Type | Ceramic PCB |
---|---|
Place Of Origin | Guangdong, China |
Material | FR4/CEM-1/CEM-3/FR1/aluminum |
Base Material | FR4/aluminum/ceramic |
Copper Thickness | 3oz |
Model Number | FLCA-G125 |
---|---|
Type | FPC |
Processing Technology | Electrolytic Foil |
Base Material | Copper |
Insulation Materials | Organic Resin |
Place Of Origin | Guangdong, China |
---|---|
Model Number | Customized |
Base Material | FR4 CEM1 CEM3 Ceramic Aluminum |
Copper Thickness | 1/2OZ 1OZ 2OZ 3OZ |
Board Thickness | 0.2mm~3.0mm |
Model Number | CUSTOM |
---|---|
Type | Consumer Electronics PCBA |
Supplier Type | OEM |
Material | FR-4 |
PCB Standard | IPC-A-610 E |
Type | Consumer Electronics PCBA |
---|---|
Place Of Origin | Guangdong, China |
Supplier Type | OEM |
Product Name | FPC |
Quality Assurance | AOI IQC PQC QA |
Place Of Origin | Guangdong, China |
---|---|
Model Number | Customized |
Base Material | FR4 CEM1 CEM3 Ceramic Aluminum |
Copper Thickness | 1/2OZ 1OZ 2OZ 3OZ |
Board Thickness | 0.2mm~3.0mm |
Type | Ceramic Circuit Board. |
---|---|
Number Of Layers | Multilayer |
Copper Thickness | 1oz |
Board Thickness | 0.2mm-6.0mm |
Min. Hole Size | 0.15mm-6.35mm |