Base Material | FPC |
---|---|
Board Material | Polyimide |
Board Thickness | 1.6 Mm |
Copper Thickness | 1 Oz (35um) |
Surface Treatment | HASL Lead Free |
Place Of Origin | Guangdong, China |
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Model Number | Customized |
Base Material | FR4 CEM1 CEM3 Ceramic Aluminum |
Copper Thickness | 1/2OZ 1OZ 2OZ 3OZ |
Board Thickness | 0.2mm~3.0mm |
Ntegration | GSIC |
---|---|
Technics | Thin Film IC |
Trademark | OEM |
Base Material | FR-4/aluminum/ceramic/cem-3/FR-1 |
Min. Line Spacing | 0.2mm |
Model Number | Custom PCB & PCB Assembly |
---|---|
PCBA Service | Support Customization |
Supplier Type | PCB Factory |
Product Name | Mechanical Keyboard |
Surface Finishing | HASL Lead Free |
Supplier Type | Factory/Manufacturer |
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Product Name | Pcba Manufacturer |
Service | Turnkey PCB/PCBA Assembly |
Type | Customizable |
Layer | 1-40 Layer |
Base Material | FR4 |
---|---|
Application | Electronics Device |
Number Of Layers | 1- 24 Layers |
Solder Mask | Green/Red/Yellow/Blue/White/Black ETC |
PCB QC | Electrical Testing,Flying Probe Tester |
Place Of Origin | Guangdong, China |
---|---|
Supplier Type | PCB Assembly Manufacturer |
Copper Thickness | 3 Oz |
Solder Mask Color | Blue.green.red.black.white |
Surface Finishing | HASL\OSP\immersion Gold |
Type | Ceramic PCB |
---|---|
Place Of Origin | Guangdong, China |
Material | FR4/CEM-1/CEM-3/FR1/aluminum |
Base Material | FR4/aluminum/ceramic |
Copper Thickness | 3oz |
Type | Rigid Circuit Board |
---|---|
Place Of Origin | Guangdong, China |
Mechanical Rigid | Rigid |
Insulation Materials | Metal Composite Materials |
Processing Technology | Electrolytic Foil |
Origin | Guangdong, China |
---|---|
Base Material | Copper |
Material | Epoxide Woven Glass Fabric Laminate |
Structure | Multilayer Rigid PCB |
Application | Electronics Device |