| Type | Combining Rigid Circuit Board |
|---|---|
| Place Of Origin | Guangdong, China |
| Material | Fiberglass Epoxy |
| Base Material | FR4 (Tg130~Tg170) |
| Insulation Materials | Epoxy Resin |
| Type | Customizable |
|---|---|
| Usage | OEM Electronics |
| Base Material | FR4 |
| Min. Line Spacing | 3 Mil (0.075 Mm) |
| Board Thickness | 1.6mm |
| Type | Electronic PCB Assembly |
|---|---|
| Origin | Guangdong, China |
| Service | PCB &PCBA Service |
| Base Material | FR-4/Aluinum/CEM1/CEM3 PCB |
| Other Service | Turnkey Assembly Service |
| Place Of Origin | Guangdong, China |
|---|---|
| Base Material | Electroless Copper/rolling Copper |
| Copper Thickness 12~50UM | 12~50UM |
| Board Thickness | 0.075~0.16MM |
| Min. Hole Size | 0.2mm |
| Type | Rigid Circuit Board |
|---|---|
| Dielectric | FR-4 |
| Material | Fiberglass Epoxy |
| Insulation Materials | Organic Resin |
| Brand | Fast PCB Technology |
| Type | Rigid Circuit Board |
|---|---|
| Origin | Guangdong, China |
| Base Material | Copper |
| Insulation Materials | Metal Composite Materials |
| Min Hole Size | 0.1mm (4 Mil) |
| Board Material | Fr4 |
|---|---|
| Board Layer | 1-24 Layers |
| Board Thickness | 0.2mm-6mm |
| Copper Thickness | 0.5oz-2oz |
| Min. Line Width/Space | 0.1mm |
| Copper Thickness | 1/2OZ 1OZ 2OZ 3OZ |
|---|---|
| Base Material | FR-4 |
| Min. Line Spacing | 4/4mil(0.1/0.1mm) |
| Board Thickness | 1.6mm-3.2mm |
| Min. Line Width | 0.1mm/4mi |
| Origin | Guangdong, China |
|---|---|
| Metal Coating | Copper |
| Mode Of Production | SMT / DIP |
| Base Material | FR-4 |
| Layers | Multilayer |
| Typy | Ceramic PCB , Customized |
|---|---|
| Place Of Origin | Guangdong, China |
| Base Material | FR4,Rogers,Aluminum |
| Copper Thickness | 0.5oz-8oz |
| Board Thickness | 0.2mm-4mm |
