| Type | Consumer Electronics Pcba |
|---|---|
| Brand Name | Customization |
| Copper Thickness | 2 OZ, 1/3oz ~6oz |
| Min. Hole Size | 0.1mm (4mil) |
| Min. Line Spacing | 1/2 Oz. Copper |
| Board Material | Fr4 |
|---|---|
| Board Layer | 1-24 Layers |
| Board Thickness | 0.2mm-6mm |
| Copper Thickness | 0.5oz-2oz |
| Min. Line Width/Space | 0.1mm |
| Type | Consumer Electronics Pcba |
|---|---|
| Place Of Origin | Guangdong, China |
| Supplier Type | OEM PCBA |
| Copper Thickness | 1oz, 0.5oz-12oz |
| Material | FR-4 |
| Model Number | Customized |
|---|---|
| Place Of Origin | Guangdong, China |
| Base Material | PI |
| Copper Thickness | 0.5OZ-2oz |
| Board Thickness | 1.0mm |
| Place Of Origin | Guangdong, China |
|---|---|
| Model Number | Customized |
| Base Material | FR4 CEM1 CEM3 Ceramic Aluminum |
| Copper Thickness | 1/2OZ 1OZ 2OZ 3OZ |
| Board Thickness | 0.2mm~3.0mm |
| Type | Consumer Electronics PCBA |
|---|---|
| Place Of Origin | Guangdong, China |
| Base Material | Copper |
| Insulation Materials | Organic Resin |
| Brand | Fast PCB Technology |
| Type | Combining Rigid Circuit Board |
|---|---|
| Place Of Origin | Guangdong, China |
| Material | Fiberglass Epoxy |
| Base Material | FR4 (Tg130~Tg170) |
| Insulation Materials | Epoxy Resin |
| Place Of Origin | Guangdong, China |
|---|---|
| Application | Electronics Device |
| Custom | OEM/ODM |
| Base Material | Copper |
| Insulation Materials | Organic Resin |
| Origin | Guangdong, China |
|---|---|
| Type | Rigid Circuit Board |
| Insulation Materials | Metal Composite Materials |
| Base Material | Copper |
| Surface Finish | HASL, Lf HASL, Imm Gold, Imm Silver, OSP Etc |
| Type | Rigid Circuit Board |
|---|---|
| Origin | Guangdong, China |
| Base Material | Copper |
| Insulation Materials | Metal Composite Materials |
| Min Hole Size | 0.1mm (4 Mil) |
