| Type | Rgid PCB |
|---|---|
| Surface Finishing | Immersion Gold/OSP |
| Base Material | Polymide, Fr4 |
| Copper Thickness | 1-6 OZ |
| Min. Hole Size | 0.2mm |
| Max. Aspect Ratio | 8:1 |
|---|---|
| Min. Silkscreen Line Width/Space | 2.5/2.5mil |
| Min. Hole Size | 0.2mm |
| Min. Annular Ring | 3mil |
| Copper Thickness | 2-6oz |
| Base Material | FR4 CEM1 CEM3 Ceramic Aluminum |
|---|---|
| Min. Line Spacing | 0.1mm/4mil |
| Min. Hole Size | 0.1mm-1mm |
| Surface Finishing | HASL,Gold Plating |
| Product Name | Electronic Boards |
| Type | Consumer Electronics Pcba |
|---|---|
| Copper Thickness | Hoz~3oz, Hoz~3oz |
| Application | Consumer |
| Base Material | FR4 (Tg130~Tg170) |
| Board Thickness | 0.6mm~10.0mm |
| Base Material | FR-4 |
|---|---|
| Copper Thickness | 0.5-6oz |
| Board Thickness | 0.2 -3 Mm |
| Min. Hole Size | 0.20mm |
| Min. Line Width | 4mil |
| Type | Rigid Circuit Board |
|---|---|
| Processing Technology | Electrolytic Foil |
| Base Material | FR-4 |
| Surface Finishing | HASL Lead Free |
| Copper Thickness | 1oz |
| Type | Print Circuit Board Board Components |
|---|---|
| Supplier Type | Factory/Manufacturer |
| Copper Thickness | 4 Oz, Inner:12-175um Outer:35-350um |
| Base Material | FR4/High TG FR-4/M4/ M6/Rogers/Nelco/Isola |
| Board Thickness | 2L: 0.20mm, 4L: 0.40mm, 6L:0.60mm, 8L:0.80mm |
| Type | Rgid PCB |
|---|---|
| Surface Finishing | Immersion Gold/OSP |
| Base Material | PI |
| Copper Thickness | 1-6 OZ |
| Board Thickness | 0.2-0.5mm |
| Place Of Origin | Guangdong, China |
|---|---|
| Base Material | FR4 ,Any Specialized Material As Per Your Choice |
| Copper Thickness | 0.3- 6 OZ |
| Board Thickness | 0.3 Mm- 4 Mm |
| Min. Hole Size | 0.20mm |
| Place Of Origin | Guangdong, China |
|---|---|
| Supplier Type | PCB Assembly Manufacturer |
| Copper Thickness | 3 Oz |
| Solder Mask Color | Blue.green.red.black.white |
| Surface Finishing | HASL\OSP\immersion Gold |
