| Copper Thickness | 1oz |
|---|---|
| Base Material | FR-4 |
| Min. Line Spacing | 0.1mm4mil) |
| Board Thickness | 1.6mm-3.2mm |
| Min. Line Width | 0.2mm |
| Model NO. | Rigid-Flex Board |
|---|---|
| Processing Technology | Electrolytic Foil |
| Base Material | Copper |
| Insulation Materials | Epoxy Resin |
| Surface Treatment | Immersion Silver, Tin, Gold/OSP/Has |
| Type | Ceramic PCB |
|---|---|
| Place Of Origin | Guangdong, China |
| Material | FR4/CEM-1/CEM-3/FR1/aluminum |
| Base Material | FR4/aluminum/ceramic |
| Copper Thickness | 1oz |
| Type | Rigid Circuit Board |
|---|---|
| Origin | Guangdong, China |
| Base Material | Copper |
| Insulation Materials | Metal Composite Materials |
| Min Hole Size | 0.1mm (4 Mil) |
| Type | Rigid Circuit Board |
|---|---|
| Origin | Guangdong, China |
| Processing Technology | Electrolytic Foil |
| Material | Paper Phenolic Copper Foil Substrate |
| Base Material | Copper |
| Type | Rigid Circuit Board |
|---|---|
| Origin | Guangdong, China |
| Base Material | Fr-4 |
| Insulation Materials | Organic Resin |
| Surface | OSP,Immersion Gold,Hal Lead Free,Hal |
| Place Of Origin | Guangdong, China |
|---|---|
| Base Material | Electroless Copper/rolling Copper |
| Copper Thickness 12~50UM | 12~50UM |
| Board Thickness | 0.075~0.16MM |
| Min. Hole Size | 0.2mm |
| Max. Aspect Ratio | 8:1 |
|---|---|
| Copper Thickness | 2-6oz |
| Min. Line Width/Space | 3/3mil |
| Min. Solder Mask Bridge | 3mil |
| Min. Annular Ring | 3mil |
| Place Of Origin | Guangdong, China |
|---|---|
| Type | Multilayer PCB |
| Number Of Layers | 1- 24 Layers |
| Base Material | FR-4 |
| Copper Thickness | 1oz |
| Type | Consumer Electronics Pcba |
|---|---|
| Place Of Origin | Guangdong, China |
| Base Material | FR4/High TG FR-4/M4/ M6/Rogers/Nelco/Isola |
| Copper Thickness | 1 Oz |
| Board Thickness | 1.6mm |
