Model Number | Customized |
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Place Of Origin | Guangdong, China |
Base Material | Polyimide |
Copper Thickness | 1 Oz |
Board Thickness | 0.2mm~3.0mm |
Model NO. | Rigid-Flex Board |
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Dielectric | FR-4 |
Material | Fiberglass Epoxy |
Mechanical Rigid | Rigid |
Layer | 1-40 Layer |
Place Of Origin | Guangdong, China |
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Insulation Materials | Epoxy Resin |
Stiffener Material | Pi |
Copper Thickness For Inner Layers | 20 Oz |
Surface Finishing | ENIG,HASL,OSP,ENEPIG,Flash Gold |
Type | Combining Rigid Circuit Board |
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Place Of Origin | Guangdong, China |
Material | Fiberglass Epoxy |
Base Material | FR4 (Tg130~Tg170) |
Insulation Materials | Epoxy Resin |
Type | Rigid Circuit Board |
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Place Of Origin | Guangdong, China |
Material | Fiberglass Epoxy |
Application | Medical Instruments |
Base Material | FR4 (Tg130~Tg170) |
Type | Power Bank PCBA |
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Place Of Origin | Guangdong, China |
Base Material | FR4 |
Substrates Material | Aluminum, FR-4,Rogers,CEM-1,Taconic,ceramic |
SSupplier Type | OEM/ODM |
Typy | Ceramic PCB , Customized |
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Place Of Origin | Guangdong, China |
Base Material | FR4,Rogers,Aluminum |
Copper Thickness | 0.5oz-8oz |
Board Thickness | 0.2mm-4mm |
Type | Ceramic PCB |
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Place Of Origin | Guangdong, China |
Base Material | 96 Aluminum Ceramic |
Material | 96 Aluminum |
Copper Thickness | 0.5-3oz |
Type | Rigid Circuit Board |
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Place Of Origin | Guangdong, China |
Processing Technology | Electrolytic Foil |
Insulation Materials | Epoxy Resin |
Base Material | Aluminum |
Type | Consumer Electronics PCBA |
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Place Of Origin | Guangdong, China |
Supplier Type | OEM PCBA |
Usage | OEM Electronics |
Material | FR-4 |