| Type | Ceramic PCB Manufacturer |
|---|---|
| Material | FR4 CEM1 CEM3 Hight TG |
| Base Material | Copper |
| Insulation Materials | Organic Resin |
| Processing Technology | Electrolytic Foil |
| Model Number | PCB-0261 |
|---|---|
| Place Of Origin | Guangdong, China |
| Base Material | FR4/High TG FR-4/M4/ M6/Rogers/Nelco/Isola |
| Copper Thickness | 1 - 4OZ |
| Board Thickness | 0.2mm~3.0mm |
| Type | Combining Rigid Circuit Board |
|---|---|
| Place Of Origin | Guangdong, China |
| Material | Fiberglass Epoxy |
| Base Material | FR4 (Tg130~Tg170) |
| Insulation Materials | Epoxy Resin |
| Place Of Origin | Guangdong, China |
|---|---|
| Model Number | Customized |
| Base Material | FR4 CEM1 CEM3 Ceramic Aluminum |
| Copper Thickness | 1/2OZ 1OZ 2OZ 3OZ |
| Board Thickness | 0.2mm~3.0mm |
| Model Number | OEM/ODM/EMS |
|---|---|
| Base Material | FR-4 |
| Copper Thickness | 0.5-6oz |
| Board Thickness | 0.2-4mm |
| Min. Hole Size | 0.1mm |
| Model Number | PCBA-0606 |
|---|---|
| Place Of Origin | Guangdong, China |
| Base Material | FR4 |
| Copper Thickness | 1 Oz |
| Board Thickness | 1.6mm |
| Type | Rigid Circuit Board |
|---|---|
| Dielectric | FR-4 |
| Material | Fiberglass Epoxy |
| Insulation Materials | Organic Resin |
| Brand | Fast PCB Technology |
| Model Number | Custom PCB & PCB Assembly |
|---|---|
| Supplier Type | OEM |
| Product Name | Mechanical Keyboard |
| Capacity | Hotswap, USB Type-C, Kailh Socket, LED |
| Speed | 0.15sec/chip,0.7sec/QFR |
