| Type | Rigid Circuit Board |
|---|---|
| Origin | Guangdong, China |
| Processing Technology | Electrolytic Foil |
| Material | Paper Phenolic Copper Foil Substrate |
| Base Material | Copper |
| Type | Consumer Electronics Pcba |
|---|---|
| Place Of Origin | Guangdong, China |
| Supplier Type | OEM PCBA |
| Copper Thickness | 1oz, 0.5oz-12oz |
| Material | FR4 Material |
| Metal Coating | Copper |
|---|---|
| Mode Of Production | SMT |
| Layers | 1~40 Layers |
| Base Material | FR4 |
| Origin | Guangdong, China |
| Place Of Origin | Guangdong, China |
|---|---|
| Base Material | Copper |
| Material | Polyester Glass Fiber Mat Laminate |
| Processing Technology | Electrolytic Foil |
| Application | Consumer Electronics |
| Model NO | Microcontroller |
|---|---|
| Surface Finishing | HASL, Enig, OSP, Immersion Au, AG, Sn |
| Layer | 1-40 Layer |
| Min.Hole Size | 0.1mm (4 Mil) |
| Min.Line Spacing | 0.1mm (4 Mil) |
| Type | Consumer Electronics Pcba |
|---|---|
| Copper Thickness | Hoz~3oz, Hoz~3oz |
| Application | Consumer |
| Base Material | FR4 (Tg130~Tg170) |
| Board Thickness | 0.6mm~10.0mm |
| Model Number | 60 Keyboard Pcb |
|---|---|
| Base Material | FR4/High TG FR-4/M4/ M6/Rogers/Nelco/Isola |
| Base Material | FR-4 |
| Layer | 1-22 Layer |
| Solder Mask | White,Black,Red,Yellow |
| Min. Solder Mask Dam | 3mil |
|---|---|
| Min. Annular Ring | 3mil |
| Min. Edge Clearance | 3mil |
| Board Thickness | 1.6-3.2mm |
| Min. Solder Mask Bridge | 3mil |
| Type | Rigid Circuit Board |
|---|---|
| Processing Technology | Electrolytic Foil |
| Base Material | FR-4 |
| Surface Finishing | HASL Lead Free |
| Copper Thickness | 1oz |
| Type | Ceramic PCB |
|---|---|
| Place Of Origin | Guangdong, China |
| Material | FR4/CEM-1/CEM-3/FR1/aluminum |
| Base Material | FR4/aluminum/ceramic |
| Copper Thickness | 3oz |
