| Model Number | Electronic Design |
|---|---|
| Type | Custom |
| Base Material | FR4 |
| Copper Thickness | Up To 6 Oz |
| Board Thickness | 1.6-6 Mm |
| Type | Rigid Circuit Board |
|---|---|
| Processing Technology | Electrolytic Foil |
| Base Material | FR-4 |
| Surface Finishing | HASL Lead Free |
| Copper Thickness | 1oz |
| Type | Rigid Circuit Board |
|---|---|
| Origin | Guangdong, China |
| Base Material | Fr-4 |
| Insulation Materials | Organic Resin |
| Surface | OSP,Immersion Gold,Hal Lead Free,Hal |
| Type | Customizable |
|---|---|
| Usage | OEM Electronics |
| Base Material | FR4 |
| Min. Line Spacing | 3 Mil (0.075 Mm) |
| Board Thickness | 1.6mm |
| Type | PCB Assembly, 94V0 Electronic |
|---|---|
| Place Of Origin | Guangdong, China |
| Supplier Type | OEM PCBA |
| Material | FR4 CEM1 CEM3 Hight TG |
| Base Material | FR4 |
| Type | Rigid Circuit Board |
|---|---|
| Origin | Guangdong, China |
| Base Material | Copper |
| Material | Complex |
| Insulation Materials | Organic Resin |
