| Type | Rigid Circuit Board |
|---|---|
| Dielectric | FR-4 |
| Material | Fiberglass Epoxy |
| Base Material | Copper |
| Insulation Materials | Organic Resin |
| Layer | 1-40 Layer |
|---|---|
| Packaging Details | Foam+Anti-static bags+cartons |
| Delivery Time | 2-3 working days |
| Payment Terms | L/C, D/A, D/P, T/T, Western Union, MoneyGram |
| Supply Ability | 30000 Square Meter/Square Meters per Month module electronic board |
| Name | FPC |
|---|---|
| Base Material | FR-4 |
| Min. Line Width | 0.1mm(Flash Gold)/0.15mm(HASL) |
| Surface Finishing | Immersion Gold |
| Copper Thickness | 1oz |
| Origin | Guangdong, China |
|---|---|
| Base Material | Copper |
| Material | Epoxide Woven Glass Fabric Laminate |
| Structure | Multilayer Rigid PCB |
| Application | Electronics Device |
| Type | Heavy Copper PCB |
|---|---|
| Place Of Origin | Guangdong, China |
| Base Material | Aluminum |
| Copper Thickness | 3u |
| Board Thickness | 0.2mm~3.0mm |
| Type | Rgid PCB |
|---|---|
| Surface Finishing | Immersion Gold/OSP |
| Base Material | Polymide, Fr4 |
| Copper Thickness | 1-6 OZ |
| Min. Hole Size | 0.2mm |
| Shipping Method | By Air, By Sea, By Land |
|---|---|
| Metal Coating | Copper |
| Mode Of Production | SMT |
| PCB/PCBA Max Size | 400*310mm |
| Production Lines | SMT &DIP Production Lines , Assembly Lines |
| Shipping Method | DHL,UPS,FedEx |
|---|---|
| PCB Material | FR4 |
| Product Name | PCB Circuit Board Assembly |
| Surface Treatment | HASL |
| Copper Thickness | 1oz |
| Product Type | Rigid Flex PCB Manufacturing |
|---|---|
| Min. Line Width/Space | 3mil/3mil |
| Solder Mask Color | Green, White, Red, Blue, Black, Yellow |
| Board Size | Max. 600mm X 600mm |
| Surface Finish | HASL, ENIG, OSP, Immersion Silver, Immersion Tin |
| Min. Solder Mask Dam | 3mil |
|---|---|
| Min. Annular Ring | 3mil |
| Min. Edge Clearance | 3mil |
| Board Thickness | 1.6-3.2mm |
| Min. Solder Mask Bridge | 3mil |
