Payment & Shipping Terms:
|Raw Material:||Fr - 4||Layer Count:||6 Layer|
|Board Thickness:||1.0 MM||Copper Thickness:||1 Oz / 35 µm|
|Surface Treatment:||Immersion Gold||Solder Mask:||Green|
|Board Size:||46.97 * 49 MM||Min. Aperture:||0.2 MM|
|Line Trace Width/Space:||0.1 / 0.11 MM|
remote control car circuit board,
power supply pcb board
Multilayer 6 Layers Enig Circuit FR4 PCB Board for Security Digital Video
For the multilayer FR4 PCB Board, the board thickness is only 1.0 mm and the copper thickness is 1 Oz / 35 µm. Also, the surface treatment of this PCB Circuit Board is immersion gold, and solder mask is green. By the way, its minimum aperture is 0.2 mm.
How to get quick quotation?
|Step 1 Please send us Gerber file with these format: .CAD / .Gerber / .PCB / .DXP / .P-CAD, etc|
|Step 2 Also please provide us the below details for quick quotation:|
Board material: Fr - 4 / CEM - 1 / CEM - 3 / 22F / Fr - 1 / others
|Material brand: SY / KB / Rogers (optional)|
|Material Specification:High Tg / copper based / aluminum based or others (optional)|
|Board thickness: 0.1 - 6.0 mm|
|Copper thickness: 0.05 Oz - 8 Oz ( 17 um - 288 um )|
|Surface Treatment: OSP / ENIG / HASL / Lead Free HASL / Immersion Tin / Immersion Sin|
|Color of solder mask and silk print: Green / red / blue / black / white / yellow ,etc|
|Board size and quantity|
If you don't have Gerber file, please provide us the imfomation as step 2 or post your PCB Board to us for clone.
|Layer count||Sample lead time/workday||Batch lead time/workday|
|18-40L (Up to difficulty)||at least 18||at least 24|
|P.S. For HDI, Blind/Buried Hole PCB: Regular Lead Time + 3 workdays|
What kinds of quality Raw Materials will be used?
|Board Brand||ITEQ, SY, Isola. Rogers, Arlon, Nelco, Taconic, Hitachi, KB,etc|
|Potion||Rohm & Haas, Atotech, Umicore|
|Printing Ink||Taiyo, Rongda|
|Dry Film||Asahi, Dupont, Etertec|
Now send us your inquiry, and you will be replied within 8 hours!
Little knowledge - Multilayer PCB Board
Multilayer printed circuit boards (Multilayer PCBs) represented the next major evolution in fabrication technology.
A very sophisticated and complex methodology came from the base platform of double sided plated.
This methodology would again allow circuit board designers a dynamic range of interconnects and applications.
Multilayer PCB board were essential in the advancement of modern computing, and their basic construction and fabrication are similar to micro chip fabrication on a micro size.
The range of material combinations is extensive from basic epoxy glass to exotic ceramic fills, and it can be built on ceramic, copper, and aluminum. Also, blind and buried vias are commonly produced in multilayer pcb manufacturing, along with pad on via technology.
Contact Person: cyan hong