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Customized Multilayer PCB Fabrication FR - 4 4 Layers For Bluetooth Earphone

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PCB Circuit Board

Customized Multilayer PCB Fabrication FR - 4 4 Layers For Bluetooth Earphone

Customized Multilayer PCB Fabrication FR - 4 4 Layers For Bluetooth Earphone
Customized Multilayer PCB Fabrication FR - 4 4 Layers For Bluetooth Earphone Customized Multilayer PCB Fabrication FR - 4 4 Layers For Bluetooth Earphone

Large Image :  Customized Multilayer PCB Fabrication FR - 4 4 Layers For Bluetooth Earphone

Product Details:

Place of Origin: Shenzhen,China
Brand Name: LEFANG
Certification: ISO9001, ISO14001, ISO/TS16949, SGS, UL, RoHs,OHSAS18000
Model Number: OT7004L558

Payment & Shipping Terms:

Minimum Order Quantity: 1 Piece
Price: Negotiable
Packaging Details: Inner: Vacuum Packing; Dry Packing out Packing
Delivery Time: 2-10 work days
Payment Terms: T/T, Western Union, Paypal
Supply Ability: 290, 000sqm Per Month
Detailed Product Description
Base Material/ Dielectric: FR - 4 Layer: 4 Layers
Surface Treatment: ENIG Copper Thickness: 1 OZ
Solder Mask: Blue Min. Aperture: 0.25 Mm
Line Width/Spacing: 0.1/ 0.1mm Size: /
Board Thickness: 1 Mm
High Light:

multilayer pcb fabrication

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custom made pcb boards

Customized Circuit Board PCB for Bluetooth Earphone
 
The 1 mm board thickness 4 layers PCB Board is applied to bluetooth earphone. While the surface treatment of the PCB Board is ENIG with blue solder mask. Also, the line width and spcaing of this PCB Circuit Board are both 0.1 mm, and the minimum aperture is 0.25 mm.
 

Technical Data
Customized Multilayer PCB Fabrication FR - 4 4 Layers For Bluetooth Earphone
 
ItemDetails
Max layer count20 L
Max board thickness6.0 mm
Max aspect ratio10 : 1
Max copper thickness6 OZ
Max dimension600 * 700mm
Min thickness of 4 layers PCB0.4 mm
Min hole / pad0.15 / 0.35mm
Hole location accuracy+ / - 0.05mm
PTH hole tolerance+ / - 0.05mm
Min line width and line space0.065 / 0.065mm
Surface treatment

 
HASL / HASL lead free, OSP
 
Immersion gold/silver/tin, gold plating (hard gold and soft gold),
 
silver plating, tin plating, platinum plating, carbon ink,
 
ENEPIG
(electroless nickel - electroless palladium - immersion gold)

 
 

How to get quick quotation?
Customized Multilayer PCB Fabrication FR - 4 4 Layers For Bluetooth Earphone
 

        Step 1    Please send us Gerber file with these format: .CAD / .Gerber / .PCB / .DXP / .P-CAD, etc
        Step 2    Also please provide us the below details for quick quotation:

                Board material: Fr - 4 / CEM - 1 / CEM - 3 / 22F / Fr - 1 / others

                Material brand: SY / KB / Rogers  (optional)
                Material Specification:High Tg / copper based / aluminum based or others (optional)
                Board thickness: 0.1 - 6.0 mm
                Copper thickness: 0.05 Oz - 8 Oz ( 17 um - 288 um )
                Surface Treatment: OSP / ENIG / HASL / Lead Free HASL / Immersion Tin / Immersion Sin
                Color of solder mask and silk print: Green / red / blue / black / white / yellow ,etc
                Board size and quantity

 
If you don't have Gerber file, please provide us the imfomation as step 2 or post your PCB Board to us for clone.
 

       SAMPLE:
 

Board Basic Info - SAMPLE

                       Board material

Fr - 4

                       Material brand

KB

                       Material Specification

Tg 170

                       Board thickness

1.6 mm

                       Copper thickness

1 Oz

                       Surface Treatment

ENIG

                       Solder mask / sSilk print

Green / White

                       Board size

100 mm * 100 mm

                       Quantity

10k

 

 
 
What kinds of quality Raw Materials will be used?
Customized Multilayer PCB Fabrication FR - 4 4 Layers For Bluetooth Earphone

 

Board BrandITEQ, SY, Isola. Rogers, Arlon, Nelco, Taconic, Hitachi, KB,etc
PotionRohm & Haas, Atotech, Umicore
Printing InkTaiyo, Rongda
Dry FilmAsahi, Dupont, Etertec
 

 

Now send us your inquiry, and you will be replied within 8 hours!

 

 

 

 

 

 

How to improve the use ratio of PCB Board

1. Enlarge the PCB panel size, the larger panel, the less margin wasted;
2. Increase the pieces of PCB Board in each Sheet, which could also decrease the margin waste;
3. If two types of PCB such as A(big) and B(small), they could not reach a good use ratio when arrayed separately, then you could consider whether is suitable to array A and B in one sheet;
4. It is great to use professional software to arrange the PCB Board array.
 

Contact Details
Shenzhen Lefang Electronics Co., Ltd

Contact Person: cyan hong

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