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6 Layers High Frequency PCB FR - 4 Material For Communication Power Amplifier

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High Frequency PCB

6 Layers High Frequency PCB FR - 4 Material For Communication Power Amplifier

6 Layers High Frequency PCB FR - 4 Material For Communication Power Amplifier
6 Layers High Frequency PCB FR - 4 Material For Communication Power Amplifier 6 Layers High Frequency PCB FR - 4 Material For Communication Power Amplifier

Large Image :  6 Layers High Frequency PCB FR - 4 Material For Communication Power Amplifier

Product Details:

Place of Origin: Shenzhen,China
Brand Name: LEFANG
Certification: ISO9001, ISO14001, ISO/TS16949, SGS, UL, RoHs,OHSAS18000
Model Number: OT7006L541

Payment & Shipping Terms:

Minimum Order Quantity: 1 Piece
Price: Negotiable
Packaging Details: Inner: Vacuum Packing; Dry Packing out Packing
Delivery Time: 2-10 work days
Payment Terms: T/T, Western Union, Paypal
Supply Ability: 290, 000sqm Per Month
Detailed Product Description
Base Material/ Dielectric: FR - 4 Layer: 6 Layers
Surface Treatment: ENIG Copper Thickness: 1 OZ
Solder Mask: Red Min. Aperture: 0.3 Mm
Line Width/Spacing: 0.1 / 0.1 Mm Size: /
Board Thickness: 1.2 Mm
High Light:

microwave circuit board

,

high speed pcb

PCB Board for Communication Power Amplifier

 

The 6 layers sided copper base PCB is applied for Communication Power Amplifier, which board thickness is 1.2 mm. And its the minimum aperture is 0.3 mm and the line width and space are both 0.1 mm. While the surface treatment of the copper base PCB is ENIG with red solder.

 

Technical Data
6 Layers High Frequency PCB FR - 4 Material For Communication Power Amplifier
 

No.

 

Item

 

Data

 

1 Layer count 1-20 layers
2 Raw material type

Halogen free FR-4, high Tg FR-4, thick copper FR-4, CEM-3, copper

 

based, aluminum based

3 Raw material brand Rogers,Isola,Arlon, ITEQ, Hitachi, SY, KB,etc
4 Board thickness 0.1-6.0mm
5 Max board size 600 mm * 700 mm
6 Solder mask Green, red, blue, black, white, yellow
7 Surface treatment

HASL/HASL lead free , OSP, Immersion gold / silver / tin , gold plating

 

(hard gold and soft gold), silver plating, tin plating, platinum plating,

 

carbon ink, and ENEPIG(electroless nickel - electroless palladium -

 

immersion gold)

8 Copper thickness 0.05 Oz - 8 Oz (17 um-288 um )
9 Min Line width /space 0.065 mm / 0.065 mm
10 Finished hole size 0.10 - 5.95 mm
11 Blind/buried via 0.10 mm
12 Aspect ratio 10:1
13 PTH tolerance + / - 0.05 mm
14 Hole location tolerance + / - 0.05 mm
15 Impedance control tolerance + / - 8% mm
16 Outline tolerance + / - 0.10 mm
 
 

How to get quick quotation?
6 Layers High Frequency PCB FR - 4 Material For Communication Power Amplifier
 

        Step 1    Please send us Gerber file with these format: .CAD / .Gerber / .PCB / .DXP / .P-CAD, etc
        Step 2    Also please provide us the below details for quick quotation:

                Board material: Fr - 4 / CEM - 1 / CEM - 3 / 22F / Fr - 1 / others

                Material brand: SY / KB / Rogers  (optional)
                Material Specification:High Tg / copper based / aluminum based or others (optional)
                Board thickness: 0.1 - 6.0 mm
                Copper thickness: 0.05 Oz - 8 Oz ( 17 um - 288 um )
                Surface Treatment: OSP / ENIG / HASL / Lead Free HASL / Immersion Tin / Immersion Sin
                Color of solder mask and silk print: Green / red / blue / black / white / yellow ,etc
                Board size and quantity

 
If you don't have Gerber file, please provide us the imfomation as step 2 or post your PCB Board to us for clone.
 

       SAMPLE:
 

Board Basic Info - SAMPLE

                       Board material

Fr - 4

                       Material brand

KB

                       Material Specification

Tg 170

                       Board thickness

1.6 mm

                       Copper thickness

1 Oz

                       Surface Treatment

ENIG

                       Solder mask / sSilk print

Green / White

                       Board size

100 mm * 100 mm

                       Quantity

10k

 

 
 
How to guarantee our high quality products?
6 Layers High Frequency PCB FR - 4 Material For Communication Power Amplifier

 

-- We employ 70 professional engineers to ensure our high quality products.

 

Department Headcount
Electronic Eng. 13
R&D Eng. 15
PE Eng. 10
CAM Eng. 26
MI Eng. 6

 

Now send us your inquiry, and you will be replied within 8 hours!

 

 

 

 

 

 

How to reduce PCB cost

1. Improve the utilization ratio of the PCB substrate material. It is better to over 85 percents;
2. To make a bigger hole size of PCBs, which is no less than 0.3mm if possible and reduce the total amount of drilling holes;
3. The minimum trace width and space of PCBs is better no less than 4 mil, or the scrap rate will be increased 3 to 5 percents;
4. Reduce the board thickness of the printed circuit boards;
5. Enhance the universality of the main products.

Contact Details
Shenzhen Lefang Electronics Co., Ltd

Contact Person: cyan hong

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