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1 OZ / 35 µM Copper Single Layer Pcb Board , Power Bank Circuit Board 1.6 MM

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Single Sided PCB

1 OZ / 35 µM Copper Single Layer Pcb Board , Power Bank Circuit Board 1.6 MM

1 OZ / 35 µM Copper Single Layer Pcb Board , Power Bank Circuit Board 1.6 MM
1 OZ / 35 µM Copper Single Layer Pcb Board , Power Bank Circuit Board 1.6 MM 1 OZ / 35 µM Copper Single Layer Pcb Board , Power Bank Circuit Board 1.6 MM

Large Image :  1 OZ / 35 µM Copper Single Layer Pcb Board , Power Bank Circuit Board 1.6 MM

Product Details:

Place of Origin: Shenzhen,China
Brand Name: LEFANG
Certification: ISO9001, ISO14001, ISO/TS16949, SGS, UL, RoHs,OHSAS18000
Model Number: LF6001L390

Payment & Shipping Terms:

Minimum Order Quantity: 1 Piece
Price: Negotiable
Packaging Details: Inner: Vacuum Packing; Dry Packing out Packing
Delivery Time: 2-10 work days
Payment Terms: T/T, Western Union, Paypal
Supply Ability: 290, 000sqm Per Month
Detailed Product Description
Raw Material: 22F Layer Count: 1 Layer
Board Thickness: 1.6 MM Copper Thickness: 1 OZ / 35 µm
Surface Treatment: Osp Solder Mask: Blue
Board Size: 130 * 71.4 MM Min. Aperture: 0.8 MM
Line Trace Width/Space: 0.4 / 0.4 MM
High Light:

led light circuit boards

,

single layer pcb board

 

 

Single Sided PCB for Power Bank Power Supply Circuit Board

 

The single sided power bank PCB Board is built with 22F raw material, with 1.6 mm board thickness. The size of this 1 layer PCB board is 8 * 80 mm, with blue solder mask and osp surface treatment. The minimum aperture is 0.4 mm. We offer you ODM or OEM service of consumer electonics applications.
 
 
1 OZ / 35 µM Copper Single Layer Pcb Board , Power Bank Circuit Board 1.6 MM
 

 

        How to get quick quotation?

1 OZ / 35 µM Copper Single Layer Pcb Board , Power Bank Circuit Board 1.6 MM

 

        Step 1    Please send us Gerber file with these format: .CAD / .Gerber / .PCB / .DXP / .P-CAD, etc
        Step 2    Also please provide us the below details for quick quotation:

                Board material: Fr - 4 / CEM - 1 / CEM - 3 / 22F / Fr - 1 / others

                Material brand: SY / KB / Rogers  (optional)
                Material Specification:High Tg / copper based / aluminum based or others (optional)
                Board thickness: 0.1 - 6.0 mm
                Copper thickness: 0.05 Oz - 8 Oz ( 17 um - 288 um )
                Surface Treatment: OSP / ENIG / HASL / Lead Free HASL / Immersion Tin / Immersion Sin
                Color of solder mask and silk print: Green / red / blue / black / white / yellow ,etc
                Board size and quantity

 

If you don't have Gerber file, please provide us the imfomation as step 2 or post your PCB Board to us for clone.

 

       SAMPLE:

 

Board Basic Info - SAMPLE

                       Board material

Fr - 4

                       Material brand

KB

                       Material Specification

Tg 170

                       Board thickness

1.6 mm

                       Copper thickness

1 Oz

                       Surface Treatment

ENIG

                       Solder mask / sSilk print

Green / White

                       Board size

100 mm * 100 mm

                       Quantity

10k

 

 
        Technical Data
1 OZ / 35 µM Copper Single Layer Pcb Board , Power Bank Circuit Board 1.6 MM
 

    No.

 

Item

 

Data

 

     1 Layer count

1-20 layers

     2 Raw material type

Halogen free FR-4, high Tg FR-4, thick copper FR-4, CEM-3, copper

 

based, aluminum based

     3 Raw material brand Rogers,Isola,Arlon, ITEQ, Hitachi, SY, KB,etc
     4 Board thickness 0.1-6.0mm
     5 Max board size 600 mm * 700 mm
     6 Solder mask Green, red, blue, black, white, yellow
     7 Surface treatment

HASL/HASL lead free , OSP, Immersion gold / silver / tin , gold plating

 

(hard gold and soft gold), silver plating, tin plating, platinum plating,

 

carbon ink, and ENEPIG(electroless nickel - electroless palladium -

 

immersion gold)

     8 Copper thickness 0.05 Oz - 8 Oz (17 um-288 um )
     9 Min Line width  /space 0.065 mm / 0.065 mm
      10 Finished hole size 0.10 - 5.95 mm
      11 Blind/buried via 0.10 mm
      12 Aspect ratio 10:1
      13 PTH tolerance + / - 0.05 mm
      14 Hole location tolerance + / - 0.05 mm
      15 Impedance control tolerance + / - 8% mm
      16 Outline tolerance + / - 0.10 mm

 

 

        Lead Time
1 OZ / 35 µM Copper Single Layer Pcb Board , Power Bank Circuit Board 1.6 MM
 
Layer count Sample lead time/workday Batch lead time/workday
1-2L 2 6
4L 5 8
6L 5 9
8L 6 10
10L 8 10
12L 8 12
14L 10 15
16L 10 18
18-40L (Up to difficulty) at least 18 at least 24
P.S. For HDI, Blind/Buried Hole PCB: Regular Lead Time + 3 workdays

 

 

        How many advanced automated equipments do we have?
1 OZ / 35 µM Copper Single Layer Pcb Board , Power Bank Circuit Board 1.6 MM

 

-- We have spent massively on purchasing below advanced automated production equipments.

 

             Equipment Name Plant in Shenzhen Plant in Dongguan
             CCD exposure machine     8    12
             AOI test machine     6     8
             Mechanical drilling rig    26    53
             Automatic edge finishing machine     2     2
             Pressing machine     2     2
             VCP     0     2
            Electroplating line     1     2
            CNC routing machine    12    12
            Automatic tester    10    16

 

 

 

Now send us your inquiry, and you will be replied within 8 hours!

 

 

 

 

 

 

Little knowledge - Multilayer PCB Board
Multilayer printed circuit boards (Multilayer PCBs) represented the next major evolution in fabrication technology.
A very sophisticated and complex methodology came from the base platform of double sided plated.
This methodology would again allow circuit board designers a dynamic range of interconnects and applications.
Multilayer PCB board were essential in the advancement of modern computing, and their basic construction and fabrication are similar to micro chip fabrication on a micro size.
The range of material combinations is extensive from basic epoxy glass to exotic ceramic fills, and it can be built on ceramic, copper, and aluminum. Also, blind and buried vias are commonly produced in multilayer pcb manufacturing, along with pad on via technology.

Contact Details
Shenzhen Lefang Electronics Co., Ltd

Contact Person: cyan hong

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