| Material | FR4 CEM1 CEM3 Hight TG |
|---|---|
| Base Material | FR-4 |
| FPC Layer | 1-8 Layers |
| Copper Thickness | 1/2 Oz Min; 12 Oz Max |
| Min. Hole Size | 0.20mm |
| Product Type | Rigid Flex PCB Manufacturing |
|---|---|
| Min. Line Width/Space | 3mil/3mil |
| Solder Mask Color | Green, White, Red, Blue, Black, Yellow |
| Board Size | Max. 600mm X 600mm |
| Surface Finish | HASL, ENIG, OSP, Immersion Silver, Immersion Tin |
| Board Size | Max. 600mm X 600mm |
|---|---|
| Product Type | Rigid Flex PCB Manufacturing |
| Max. Layer Count | 12-Layer |
| Board Material | FR-4, Polyimide, Aluminum |
| Solder Mask Color | Green, White, Red, Blue, Black, Yellow |
| Min. Hole Size | 0.2mm |
|---|---|
| Min. Line Width/Space | 3mil/3mil |
| Product Type | Rigid Flex PCB Manufacturing |
| Surface Finish | HASL, ENIG, OSP, Immersion Silver, Immersion Tin |
| Board Size | Max. 600mm X 600mm |
| Color Of PCB | Green、Black 、Orange、Blue、Customized |
|---|---|
| Connector | Type C、USB、Micro USB |
| Base Material | Fr4/Customized |
| Surface Finishing | HASL Lead Free |
| Copper Thickness | 1oz |
| Model Number | Customized |
|---|---|
| Type | Consumer Electronics PCBA |
| Place Of Origin | Guangdong, China |
| Supplier Type | OEM PCBA |
| MOQ | 1PCS |
| Type | Rigid Circuit Board |
|---|---|
| Place Of Origin | Guangdong, China |
| Mechanical Rigid | Rigid |
| Insulation Materials | Metal Composite Materials |
| Processing Technology | Electrolytic Foil |
| Surface Finish | ENIG |
|---|---|
| Material | Flexible PCB |
| Min. Line Width | 0.1mm |
| Copper Thickness | 1oz |
| Layer | 2-layer |
| Min. Hole Size | 0.2mm |
|---|---|
| Min. Line Width | 0.1mm |
| Surface Finish | ENIG |
| Min. Line Spacing | 0.1mm |
| Material | Flexible PCB |
| Min. Line Width | 0.1mm |
|---|---|
| Material | Flexible PCB |
| Board Thickness | 1.6mm |
| Solder Mask Color | Green |
| Copper Thickness | 1oz |
