| Type | PCBA-1017 |
|---|---|
| Supplier Type | Factory/Manufacturer |
| Product Name | Pcb Board Component |
| Supplier Type | PCB, PCBA, FPC, HDI, Rfpc |
| Material | Fr4 Cem1 Cem3 Hight Tg |
| Base Material | FR4 |
|---|---|
| Application | Electronics Device |
| Number Of Layers | 1- 24 Layers |
| Solder Mask | Green/Red/Yellow/Blue/White/Black ETC |
| PCB QC | Electrical Testing,Flying Probe Tester |
| Copper Thickness | 1/2OZ 1OZ 2OZ 3OZ |
|---|---|
| Base Material | CEM-1 OR FR-4 |
| Min. Line Spacing | 0.1mm4mil) |
| Board Thickness | 0.5~3.2mm |
| Min. Line Width | 0.1mm/4mil |
| Copper Thickness | 1/2OZ 1OZ 2OZ 3OZ |
|---|---|
| Base Material | CEM-1 OR FR-4 |
| Min. Line Spacing | 0.1mm4mil) |
| Board Thickness | 0.5~3.2mm |
| Min. Line Width | 0.1mm/4mi |
| Place Of Origin | Guangdong, China |
|---|---|
| Type | Consumer Electronics PCBA |
| Copper Thickness | 1oz |
| Base Material | FR-4 |
| Min. Line Spacing | 0.1mm4mil) |
| Copper Thickness | 1oz |
|---|---|
| Base Material | FR-4 |
| Min. Line Spacing | 0.1mm4mil) |
| Board Thickness | 1.6mm-3.2mm |
| Min. Line Width | 0.2mm |
| Type | Combining Rigid Circuit Board |
|---|---|
| Place Of Origin | Guangdong, China |
| Material | Fiberglass Epoxy |
| Base Material | FR4 (Tg130~Tg170) |
| Insulation Materials | Epoxy Resin |
| Type | Consumer Electronics PCBA |
|---|---|
| Place Of Origin | Guangdong, China |
| Material | Fiberglass Epoxy Resin + Polyimide Resin |
| Base Material | Aluminum |
| Insulation Materials | Metal Composite Materials |
| Type | Rigid Circuit Board |
|---|---|
| Origin | Guangdong, China |
| Base Material | Fr-4 |
| Insulation Materials | Organic Resin |
| Surface | OSP,Immersion Gold,Hal Lead Free,Hal |
| Type | Rigid Circuit Board |
|---|---|
| Origin | Guangdong, China |
| Mechanical Rigid | Rigid |
| Material | Fiberglass Epoxy |
| Board Material | Fr4, H-Tg, It-180A, Cem, Aluminum, Copper Base |
