Base Material | FR4 |
---|---|
Application | Electronics Device |
Number Of Layers | 1- 40 Layers |
Solder Mask | Green/Red/Yellow/Blue/White/Black ETC |
PCB QC | Electrical Testing,Flying Probe Tester |
Base Material | FPC |
---|---|
Board Material | Polyimide |
Board Thickness | 1.6 Mm |
Copper Thickness | 1 Oz (35um) |
Surface Treatment | HASL Lead Free |
Type | Rigid Circuit Board |
---|---|
Place Of Origin | Guangdong, China |
Base Material | FR-4/High TG FR-4/CEM-3/CEM-1 |
Copper Thickness | 1/2OZ 1OZ 2OZ 3OZ |
Board Thickness | 1.6mm |
Place Of Origin | Guangdong, China |
---|---|
Type | Consumer Electronics PCBA |
Copper Thickness | 1 Oz |
Application | Electronics Device |
Service | OEM Services Provided |
Type | Consumer Electronics PCBA, USB Board |
---|---|
Place Of Origin | Guangdong, China |
Solder Resist Color | Green;Red;Yellow;Black;White |
Supplier Type | PCB, PCBA, FPC, HDI, Rfpc |
Keywords | OEM Contract Manufacturing PCB |
Model Number | OEM/ODM/EMS |
---|---|
Place Of Origin | Guangdong, China |
Base Material | FR-4 |
Surface Finishing | HASL Lead Free |
Layer | 1-40 Layer |
Type | Flexible Circuit Board |
---|---|
Place Of Origin | Guangdong, China |
Supplier Type | Factory/Manufacturer |
Copper Thickness | 1 Oz |
Service | One-Stop FPC Assembly |
Type | Ceramic PCB Manufacturer |
---|---|
Material | FR4 CEM1 CEM3 Hight TG |
Base Material | Copper |
Insulation Materials | Organic Resin |
Processing Technology | Electrolytic Foil |
Type | Ceramic PCB Manufacturer |
---|---|
Material | FR4 CEM1 CEM3 Hight TG |
Base Material | Copper |
Insulation Materials | Organic Resin |
Processing Technology | Electrolytic Foil |
Layer | 1-40 Layer |
---|---|
Copper Thickness | 1/2OZ 1OZ 2OZ 3OZ |
Base Material | FR-4 |
Min. Line Spacing | 0.1mm4mil) |
Board Thickness | 0.5~3.2mm |